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The present research letter is dedicated to a detailed analysis of a double-gate tunnel field-effect transistor (DG-TFET). The DG-TFET provides improved on-current (ION) than a conventional TFET via bandto-band (B2B) tunneling. However, DG-TFET is disadvantageous for low-power applications because of increased off-current (IOFF) due to the large ambipolar current (Iamb). In this research work, a Si/GaAs/ GaAs heterostructure DG-TFET is considered as research base for investigation of device performance. The electrical parameters of the DG-TFET device have been improved in comparison to the homostructure. The transfer (I-V) characteristics, capacitance voltage (C-V) characteristic of homo structure Si/ Si/Si and hetero structure Si/GaAs/GaAs, DG-TFET both structures is analysed comparatively. The C-V characteristics of DG-TFET have obtained using operating frequency of 1 MHz. The ambipolar current Iamb is suppressed by 5 × 108 order of magnitude in proposed Si/GaAs/GaAs hetero DG-TFET as compared to Si/Si/Si homo DG-TFET up to the applied drain voltage very low equal to VDS = 0.5 V without affecting onstate performance. The simulation result shows a very good ION/IOFF ratio (10 13) and low subthreshold slope, SS (~36.52 mV/dec). The various electrical characteristics of homo and hetero DGTFET such as on-current (ION), off current (IOFF), time delay (ιd), transconductance (gm) , and power delay product (PDP) have been improve in Si/GaAs/GaAs heterostructure DG-TFET and compared with Si/Si/ Si homo DG-TFET. The advantageous results obtained for the proposed design show its usability in the field of digital and analog applications.

Suppression of Ambipolar Current and Analysis of RF Performance in Double Gate Tunneling Field Effect Transistors for Low-Power Applications