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The effect of thickening of intermetallic compound layers formed at the interface and shear properties of solder joints are studied as a function of aging for lead-free solders. The modified double lap shear test method is employed to measure the shear strength and shear strain. The test specimens are Sn-3.5Ag and Sn-3.5Ag-1Zn solders and they were aged up to 2880 h at 423 K.

The mechanical properties of a joint of Sn-3.5Ag-1Zn solder and Cu substrate with aging treatment