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This paper aims to research and analyze the heat dispersion of small variable capacity refrigeration system which is used for cooling the chips with high heating flux. The cooling system was built for researching what influence refrigerant charge will bring to the performance of the system, such as suction-exhaust pressure and temperature as well as refrigerating capacity of the system. Simulation experiment has been established to contrast the performances of system with evaporative cooling plate and water-cooled cooling plate respectively. The result shows it takes less time to make the temperature of the chip stable with the former system. Moreover, the temperature can keep at a lower level.

Research on Small-scale Variable Capacity Evaporative Cooling Plate System for Chips with High Heating Flux