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In an inkjet printer head a silicon barrier plate exists between an orifice plate and ink reservoir. This silicon plate needs to be machined to create slot to let ink through to the nozzle. While currently available green Diode Pumped Solid State (DPSS) lasers have done adequate job in machining silicon for creating slot, a new generation of high-power, high-repetition rate green Quasar hybrid fiber laser with TimeShiftTM capability developed by Spectra Physics allows doubling of silicon ablation process efficiency. By optimizing power, repetition rate, pulse width, number of pulses in a burst, and pulse separation time between sub-pulses within a burst, we have demonstrated that material removal efficiency can be doubled. We have also demonstrated that quality of the ablated features can be improved tremendously. We present experimental results of careful and systematic study that shows huge benefit higher power and repetition rate along with complete temporal control of pulse output can provide for silicon ablation.

Doubling Silicon Ablation Process Efficiency and Improving Quality Using High Power High Repetition Rate Green Laser with TimeShift™ Capability