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This paper presents a unique through hole forming method in machinable ceramics using a flowable backing material during nanosecond pulse UV laser radiation. While processing through holes, the flowable backing material is arranged to be in contact with the back side of machinable ceramics, i.e., surface of laser beam's exit side. The laser beam which penetrated machinable ceramics strikes the flowable backing material and superheated plasma is generated by the laser beam’s absorption into the flowable backing material around exit hole. The induced plasma is elevated with the flowable backing material from the back side of machinable ceramics to the front side of that by a capillary phenomenon, and the shape of through holes changed from tapered shape to straight shape by the elevation of plasma. Through this technique, we are able to make substrate for a probe card which has straight shape holes with narrow pitch.

Straight Through Hole Drilling in Machinable Ceramics