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Heat dissipation is becoming more and more challenging with the preface of  new electronic components having staggering heat generation levels. Present  day solutions should have optimized outcomes with reference to the heat sink  scenarios. The experimental and theoretical results for plate type heat  sink based on mathematical models have been presented in the first part of  the paper. Then the parametric optimization (topology optimization) of plate  type heat sink using Levenberg-Marquardt technique employed in the COMSOL  Multiphysics® software is discussed. Thermal resistance of heat sink is  taken as objective function against the variable length in a predefined  range. Single as well as multi-parametric optimization of plate type heat  sink is reported in the context of pressure drop and air velocity (Reynolds  number) inside the tunnel. The results reported are compared with the  numerical modeled data and experimental investigation to establish the  conformity of results for applied usage. Mutual reimbursements of greater  heat dissipation with minimum flow rates are confidently achievable through  balanced, heat sink geometry as evident by the presented simulation outcome.  About 12% enhancement in pressure drop and up to 51% improvement in thermal  resistance is reported for the optimized plate fin heat sink as per data  manifested.

Thermal analysis and parametric optimization of plate fin heat sinks under forced air convection