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The present study relates the vibration behavior at the tip of wedge-tool during ultrasonic wire bonding with the state of adhesion at the interface of aluminum wire and silicon substrate. Cyclic change in amplitude by applying time of ultrasonic vibration is successfully detected by monitoring the vibration at the tip of wedge-tool. The spectral analysis indicates that local adhesion is not formed during increasing and high-amplitude stage of the cycle, while that is formed during decreasing and low-amplitude stage. By repeating such adhesion and separation, wire is deformed to a sufficient level to form a macroscopic bond. The ultrasonic vibration enhanced deformation of wire possibly occurs when the local adhesion is achieved. The amplitude of vibration affects the deformation rate.

Relation between Vibration of Wedge-Tool and Adhesion of Wire to Substrate during Ultrasonic Bonding