English (United Kingdom)

https://curated-unify.zendy.io/wp-json/zendy-region/v1/featured_content/oa?rat=en

https://curated-unify.zendy.io/wp-json/zendy-region/v1/highlighted_journal/

Global: Zendy Plus annual

Presents the access of premium content as premium feature

Premium Content

Presents the keyphrase highlighting as premium feature

Keyphrase Highlighting

Presents the summarisation as premium feature

Summarisation

Insights

Presents the pdf analysis as premium feature

PDF Analysis

Presents the zaia usage as premium feature

ZAIA

Global: Zendy Tools annual

Global: Zendy Free Plan

Global: Zendy Tools monthly

Global: Zendy Plus monthly

In this article the authors focus on the research of the heat dissipation problem in electronic devices. For this purpose, a series of the numerical simulations were performed, a RC model of the electronic system with two heat sources was the object of the research. To confirm the results of the simulations, thermographic measurements were carried out. During the simulations, electronic system cooling conditions were changed as a result of varying model parameters. In the laboratory, cooling conditions of electronic system were dependent on the airflow speed around it. What is more, both simulations and measurements were performed for different positions and distances between heat sources. The authors estimated cooling conditions of the electronic system with two heat sources, with a particular interest set to the position and the distance between the heat sources. In this work the authors demonstrate, that a distribution of the heat sources in the investigated electronic system improves cooling conditions.

Frequency analysis of convective cooling for the multi heat-source electronic systems – modeling and IR measurements