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High-speed laser drilling using low laser power and flexible circuit layout changes was applied to form 3-dimensional circuits in multilayer ceramics to fabricate miniaturized chip inductors and high-frequency power amplifier modules. The optimized combination of pulse YAG laser energy and the laser absorption coefficient of machined materials enabled ultra-fine through-holes to be formed in thin ceramic green sheets without damaging supporting plastic film where ceramic slurry was cast. Drilling basically involved thermal ablation

Laser Drilling Technique for Multilayer Ceramic Chip Component and Module.