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非会員 庄 司 康 則 非会員 南 和幸 正 員 江刺 正 喜 (東北大) Glass-silicon Anodic Bonding for the Reduction of Structural Distortion Yasunori Shoji, Non-member, Kazuyuki Minami, Non-member, Masayoshi Esashi, Member (Tohoku University) Glass-silicon anodic bonding has been used for the fabrication fsilicon micro sensors. A structural distortion during the anodic bonding process is sometimes observed and leads to the difficulty in fabricating the sensors with narrow gaps. It is considered that the distortion ismainly caused by not only the deference of thermal expansion coefficient be ween glass and silicon but also the structural change with the movement of ions in glass plate. This paper describes the experimental results which shows the effects ofthe bonding temperature and the movement of the positive ion in glass plate. It is also demonstrated that the structural distortion can be reduced by using a thick glass plate having high rigidity. キーワー ド:陽 極接合 熱膨張 マイクロマシーニ ング