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In the field of high voltage engineering, it has been desired for long time to improve the internal PD resistance of epoxy resin without lowering other properties. Recently, the authors discovered that some sulfur compound as curing agents or simple additives improved the PD resistance of rubber markedly, and this time we have tried to apply this fact to the case of epoxy resin. As was expected, some sulfur compounds containing-SS-bond suppress the deterioration of epoxy resin due to internal partial discharges, and the larger the molecular weight of organic group combining to the-SS-bond, the longer the effective life of additives. Moreover, in order to make full use of these additives, it is very improtant to restrict moisture in the insulation systems. From this study, the authors have proposed the chemical formulation of suppressive effect of additives for deterioration of epoxy resin due to internal partial discharges.

Improvement of Partial Discharge (PD) Resistance of Epoxy Resin by using Sulfur Containing Additives