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小 泉 雄 大*1, 上 坊 寺 明 人*2 長 原 邦 明*2, 石 塚 勝*3 Development of Thermal Design Method Incorporated with the Electric Circuit Design for SMPS (In Case of Natural Convection Air Cooled SMPS) Katsuhiro KOIZUMI*4, Akito JOBOJI, Kuniaki NAGAHARA and Masaru ISHIZUKA *4 Department of Design Engineering, COSEL Co., Ltd., 1-6-43 Kamiakae-mach, Toyama-shi, Toyama, 930-0816 Japan This paper describes an application example of thermal flow simulation to the design of a switch mode power supply (SMPS), that is natural convection air-cooled. As a simulation tool, a commercially available computational fluid dynamics (CFD) software was used and the modeling of configuration conditions was considered. In particular, the modeling of printed circuit board (PCB) and power semiconductor devices was examined by using the design of experiments method. As the heat generation sources, a field effect transistor (FET) and a diode were considered in the simulation, the calculation method of power loss is described. The difference between measured and calculated temperature values for power semiconductor devices was found to be within approximately 10 K.