Measurement of Biaxial Stress Using an Electrodeposited Copper Foil with a Microcircular Hole. 4th Report. Method Using the Probability Process of the Occurrence of Slip Line. | Zendy

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Measurement of Biaxial Stress Using an Electrodeposited Copper Foil with a Microcircular Hole. 4th Report. Method Using the Probability Process of the Occurrence of Slip Line.

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