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In this work, the boriding of binary (Ni‐Ti) and ternary (Ni‐Ti‐Cu) shape memory alloys was carried out in a solid medium at 1173 K for 8 h using the powder pack method with Ekabor-Ni powders. Characterization of boride layer formed on the surface of alloys was identified by optical microscopy and scanning electron microscopy. TiB2, NiB2 and SiC phases in the boride layer of borided binary (Ni‐Ti) and ternary (Ni‐Ti‐Cu) shape memory alloys was confirmed by X-ray diraction analysis. The microhardness and thickness of the boride layers were measured. The obtained hardness values show a hardness anomaly due to porosity and structural defects with increase of Cu content, while a decrease in the value of hardness moving from the boride layer to main structure was observed.

Boriding of Binary Ni-Ti and Ternary Ni-Ti-Cu Shape Memory Alloys