English (United Kingdom)

https://curated-unify.zendy.io/wp-json/zendy-region/v1/featured_content/oa?rat=en

https://curated-unify.zendy.io/wp-json/zendy-region/v1/highlighted_journal/

Global: Zendy Plus annual

Presents the access of premium content as premium feature

Premium Content

Presents the keyphrase highlighting as premium feature

Keyphrase Highlighting

Presents the summarisation as premium feature

Summarisation

Insights

Presents the pdf analysis as premium feature

PDF Analysis

Presents the zaia usage as premium feature

ZAIA

Global: Zendy Tools annual

Global: Zendy Free Plan

Global: Zendy Tools monthly

Global: Zendy Plus monthly

Ultrasonic-assisted transient liquid phase bonding of pure Cu with Sn-In solder was realized at 140°C in air. Shear test was carried out on the weldment. The effect of ultrasonic vibration on microstructure and mechanical properties of the weld seam was studied. The relationship between the formation of intermetallic compounds and their mechanical properties was analyzed by means of electronic scanning and element analysis. (Sn) solid solution, ε(Cu 3 Sn), η(Cu 6 Sn 5 ), Cu 10 Sn 3 , Cu 11 In 9 , Cu 9 In 4 , γ, β phase were detected in the weld seam. When the ultrasonic vibration time is 30 s, the shear strength reached a maximum of 22.76 MPa. The fracture occurred on the surface of the fine-grained η(Cu 6 Sn 5 ) phase. The fracture surface was partially covered with coarse-grained Cu 11 In 9  phase, which belonged to a brittle fracture.

Microstructure and mechanical properties of Cu/Sn-In/Cu joints obtained by ultrasonic-assisted transient liquid phase bonding in air