English (United Kingdom)

https://curated-unify.zendy.io/wp-json/zendy-region/v1/featured_content/oa?rat=en

https://curated-unify.zendy.io/wp-json/zendy-region/v1/highlighted_journal/

Global: Zendy Plus annual

Presents the access of premium content as premium feature

Premium Content

Presents the keyphrase highlighting as premium feature

Keyphrase Highlighting

Presents the summarisation as premium feature

Summarisation

Insights

Presents the pdf analysis as premium feature

PDF Analysis

Presents the zaia usage as premium feature

ZAIA

Global: Zendy Tools annual

Global: Zendy Free Plan

Global: Zendy Tools monthly

Global: Zendy Plus monthly

A normally-OFF GaN metal-insulator-gate high electron mobility transistors with fluorine doped gate insulator has been fabricated using standard ion implantation technique. Fluorine ions with negative charges were doped lightly into both the gate insulator and the partially recessed barrier layer, resulting in high positive threshold voltage (<inline-formula> <tex-math notation="LaTeX">${V} _{\mathrm{ th}}$ </tex-math></inline-formula>) for the device, meanwhile preserving low ON-resistance. Compared to the fluorine-free and recess-free device, only about 16&#x0025; increase of ON-resistance was observed for the F&#x2212; doped devices. The fabricated F&#x2212; doped device exhibits a threshold voltage of &#x002B;0.68 V at <inline-formula> <tex-math notation="LaTeX">${I} _{\mathrm{ DS}}= 5~\mu \text{A}$ </tex-math></inline-formula>/mm, a current density of 620 mA/mm, an OFF-state breakdown voltage of 800 V, and high ON/OFF current ratio of 1010. For thermal stability consideration of fluorine dopant, the <inline-formula> <tex-math notation="LaTeX">${V} _{\mathrm{ th}}$ </tex-math></inline-formula>-thermal stability test and positive bias temperature instability test were also discussed.

Normally-OFF GaN MIS-HEMT With F− Doped Gate Insulator Using Standard Ion Implantation

Normally-OFF GaN MIS-HEMT With F⁻ Doped Gate Insulator Using Standard Ion Implantation