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Although 3D IC technology can provide very high integration density, they suffer from having hotspots that may reach 1000's of degrees. To manage this heat, it is necessary to study the dynamics of cooling and thermal behavior of the ICs. In this study, we report on the dynamics of microchannel liquid cooling using water, R22, and liquid nitrogen. The study shows that using diamond cooling blocks ensures normal operating temperature of 60 C or less, using any of the above coolants. Using SiO2 blocks, only liquid nitrogen can provide acceptable operating temperatures. The study shows also that liquid latent energy and inlet velocity play a major role in the cooling dynamics.

Investigation of the Dynamics of Liquid Cooling of 3D ICs