English (United Kingdom)

https://curated-unify.zendy.io/wp-json/zendy-region/v1/featured_content/oa?rat=en

https://curated-unify.zendy.io/wp-json/zendy-region/v1/highlighted_journal/

Zendy Plus

Presents the access of premium content as premium feature

Premium Content

Presents the keyphrase highlighting as premium feature

Keyphrase Highlighting

Presents the summarisation as premium feature

Summarisation

Insights

Presents the pdf analysis as premium feature

PDF Analysis

Presents the zaia usage as premium feature

ZAIA

Zendy Tools

Zendy Open

International audienceIn this paper, the transport properties of alloyed Ti/Al Ohmic contacts formed on p-type Al-implanted silicon carbide (4H-SiC) were studied. The morphology of p-type implanted 4H-SiC was controlled by using a capping layer during post-implantation activation annealing at 1700°C. The different morphological conditions does not affect the macroscopic electrical properties of the implanted SiC (like the sheet resistance or the mobility). On the other hand, the improved morphology of implanted SiC allows to achieve a flatter Ti/Al surface and a lower specific contact resistance. The temperature dependence of the specific resistance of the contacts was studied to get physical insights into the carrier transport mechanism at the metal/SiC interface. The fit comparing several models shows that thermionic field emission is the dominant transport mechanism through the metal/SiC interface, and that a reduction of the barrier height from 0.51eV to 0.46 eV is associated to the improvement of the Ohmic properties. Transmission Electron Microscopy analysis showed the presence of a laterally inhomogeneous microstructure of the metal/SiC interface. The reduction of the barrier height could be correlated with the different microstructure of the interfacial region

Structural and transport properties in alloyed Ti/Al Ohmic contacts formed on p-type Al-implanted 4H-SiC annealed at high temperature