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In response to the critical needs of high power density, advanced thermal gap fillers (TGF) are required for the long-term reliability of electronics packaging. In this study, dispensable thermal gap filler (Al87GO6) with 87 wt.% Al 2 O 3 , 6 wt.% graphene oxide and 7 wt.% polymers were fabricated as two parts (Part A and Part B). The thermal conductivity of cured Al87GO6 (3.87 W/m.K) was 1.03, 1.11 and 1.24 times higher than commercially available thermal gap fillers TGF A, TGF B and TGF C, respectively. Part A and Part B components of Al87GO6 TGF exhibit a higher plateau value of zero shear viscosity. The lightweight graphene oxide has significantly reduced Al87GO6 TGF’s density by ~30–48%. The dielectric constant of Al87GO6 TGF was around ~6–17% lower than commercial TGF. Hence, the fabricated Al87GO6 TGF can be used as an alternative TGF for efficient heat dissipation.

materials technology

Synthesis of dispensable PDMS/Al 2 O 3 /GO thermal gap filler and performance comparison with commercial thermal gap fillers for electronics packaging applications