English (United Kingdom)

https://curated-unify.zendy.io/wp-json/zendy-region/v1/featured_content/oa?rat=en

https://curated-unify.zendy.io/wp-json/zendy-region/v1/highlighted_journal/

Global: Zendy Plus annual

Presents the access of premium content as premium feature

Premium Content

Presents the keyphrase highlighting as premium feature

Keyphrase Highlighting

Presents the summarisation as premium feature

Summarisation

Insights

Presents the pdf analysis as premium feature

PDF Analysis

Presents the zaia usage as premium feature

ZAIA

Global: Zendy Tools annual

Global: Zendy Free Plan

Global: Zendy Tools monthly

Global: Zendy Plus monthly

In this article, we propose a temperature-based crosstalk analysis model for rough edge graphene nanoribbon (GNR) and Cu interconnect. Temperature-dependent crosstalk delay and noise analysis for 16 nm technology node (ITRS-2011) is performed for three different chip-operating temperatures are −40°C (233 K),  i.e.  low temperature, 27°C (300 K),  i.e.  room temperature, and 105°C (378 K),  i.e.  high temperature. Our analysis shows that, first by increasing the temperature from 233 to 378 K and also by increasing interconnect length from 10 to 100 µm, the GNR shows less amount of crosstalk-induced delay compared with Cu interconnect and crosstalk noise increase slightly which indicates the performance degradation and reliability issues, second the GNR-based interconnect produce (%) variation in delay due to crosstalk and crosstalk noise is lesser than Cu interconnect when interconnect length increase from 10 to 100 µm by increasing temperature. Hence, GNR interconnect is much more thermally viable as compared with traditional Cu-based interconnect and it is very much useful for nano-scale interconnect modeling.

Analysis of Temperature-Dependent Crosstalk for Graphene Nanoribbon and Copper Interconnects