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This paper presents the adhesive strength values of electrodeposited nickel, zinc, and iron coatings on copper substrates at various deposition parameters, including laser-assisted stimulation of the deposition process. One of the factors determined to be responsible for the adhesive strength of metal films with a metal substrate is the formation of a diffusion zone at the ‘coating-substrate’ interface. It is shown that an increase in adhesive strength is achieved due to the expansion of the diffusion zone and the formation of solid solutions. The decrease in adhesive strength at high overpotentials is associated with the release of hydrogen and the formation of intermediate phases.

Adhesion strength of electrodeposited Ni, Zn, and Fe coatings with copper substrates