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Digital image correlation method (DIC) using the correlation coefficient  curve-fitting for full-field surface deformation measurements of organic  insulator films is investigated in this work. First the validation of the  technique was undertaken. The computer-generated speckle images and the  measurement of coefficient of thermal expansion (CTE) of aluminium are used to  evaluate the measurement accuracy of the technique. In a second part the  technique is applied to measure the mechanical deformation induced by electrical  field application to organic insulators. For that Poly(ethylene naphthalene  2,6-dicarboxylate) (PEN) thin films were subjected to DC voltage stress and DIC  provides the full-field induced deformations of the test films. The obtained  results show that the DIC is a practical and robust tool for better  comprehension of mechanical behaviour of the organic insulator films under  electrical stress

Measurement of full-field deformation induced by a dc electrical field in organic insulator films