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This paper investigated thin films deposition processes of silica (SiO2) based on the injection of liquid droplets in a low temperature plasma torch operated in open air at atmospheric pressure. An aerosol of hexamethyldisilane is produced by a syringe-pump and injected in a nitrogen post-discharge for different liquid precursor and carrier gas flow rates. For high carrier gas flow, this process enables to form SiO2 without addition of oxygen in the plasma phase. This process offers a thin film dynamic deposition rate from 500 to 1400 nm.m.min-1 depending on the carrier gas flow and the film structure departs from SiO2 to organosilicon layers for the lowest flow rates. These evolutions are attributed to plasma - droplets interactions related to the transport of droplets, the evaporation of liquid and plasma polymerization.

Aerosol assisted atmospheric pressure plasma jet for a high deposition rate of silica-like thin films