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In the context of the ATHENA X-IFU Cryogenic AntiCoincidence Detector(CryoAC) development, we have studied the thermalization properties of a 2mm x2mm SQUID chip. The chip is glued on a front-end PCB and operated on the coldstage of a dilution refrigerator (TBASE < 20 mK). We performed thermalconductance measurements by using different materials to glue the SQUID chip onthe PCB. These have been repeated in subsequent cryostat runs, to highlightdegradation effects due to thermal cycles. Here, we present the resultsobtained by glues and greases widely used in cryogenic environments, i.e. GE7031 Varnish Glue, Apiezon N Grease and Rubber Cement.

journal of low temperature physics

Thermalization of a SQUID chip at cryogenic temperature: Thermal  conductance measurement for GE 7031 Varnish Glue, Apiezon N Grease and Rubber  Cement between 20 and 200 mK